3-Dimensional Computer Processor

3-Dimensional Computer Processor

Scientist at University of Rochesterb have developed a new generation of Computer Processors. These processors are based on 3-Dimensional Circuits in contrary to 2-Dimensional Circuits of today.

This can be said as the next major advance in computer processors technology. The latest 3-D processor is running at 1.4 gigahertz in the labs of University.

PAST ATTEMPTS VS LATEST RESEARCH

In the past attempts of making 3-D chips, scientist were just making a stack of regular processors. But at University of Rochesterb it was designed and built specifically to optimize all key processing functions vertically, through multiple layers of processors, the same way ordinary chips optimize functions horizontally.

This design means that every tasks such as Synchronicity, Power Distribution, and Long-Distance Signaling are all fully functioning in three dimensions for the first time.

EBY FRIEDMAN: THE MAN BEHIND 3-D CHIPS

Eby Friedman and his students has designed this chip, which uses many of the tricks of regular processors, but also accounts for different impedances that might occur from chip to chip, different operating speeds, and different power requirements. According to Eby Friedman, Professor of Electrical and Computer Engineering at Rochester and faculty director of the pro of the processor says:- "I call it a cube now, because it's not just a chip anymore. This is the way computing is going to have to be done in the future. When the chips are flush against each other, they can do things you could never do with a regular 2D chip"




TODAYS INTEGRATED CHIPS AND PROBLEMS

The problem with today's technology of integrated circuits is that, beyond a limit it is impossible to pack more chips next to each other which limits the capabilities of future processors. So number of integrated circuit designers anticipate someday expanding into the third dimension, stacking transistors on top of each other.